MT-B100

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TV COF Bonding machine for Lcd Led Tv Screen panel Repair MT-B100

Overview

COF Bonding machine is used in a variety of FPC, COF,TAB and LCD Panel and PCB combination bonding, is reflected in a variety of sizes LCD vertical, horizontal, vertical band,horizontal belt,black belt, black, colored thread, ribbon , multi-line, black, black and white, vertical half display,horizontal half breakdown maintenance.

MT-B100 Specification for Download

Specification

Single Head Bonding Machine
Machine Name	COMPUTLER LAPTOP TV LCD PANEL REPAIR COF BONDING MACHINE; PULSE HEAT HOT PRESS MACHINE; DOUBLE HEAD BONDING MACHINE
MODEL Number	MT-B100
Latest version	In 2015
Popular Country	TURKEY; BRAZIL; UK;
Function	Ic tab cof flex cable replacement; pcb replacement;
Application	Lcd screen panel display repair and refurbishment
Usage	LCD vertical/horizontal lines, vertical/horizontal belt, black belt, black/colored thread, ribbon, multi-color lines, display black, black- white, vertical half display
Features	PULSE HEAT HOT PRESS, DOUBLE BONDING HEADS, DOUBLE PNEUMATIC DEVICES,DOUBLE TEMPERATURE CONTROLS
Applicable LCD Panel Size	13 inches to 100 inches Led Lcd Screen panel; Led Lcd TV screen panel.
Applicable LCD panel thickness	0.3MM-1.1MM [Single glass]
Panel type	TFT
Bonding IC number	One/PANEL
Bonding head size	Highly recommended *681.2 or 681.4*
Bonding head size	Per customer’s requirement. CUSTOMIZED PER LAPTOP PCB SIZES
Equipment process time	TFT，3.8S/chip
Bonding accuracy	±1.5µm (support 4K)
POSITION ACCURACY	±0.5μm
work environment	Clean, dust-free, clean room
Working Air pressure	0.1~0.7Mpa Dry air source
Power supply	AC 220V±10%，50HZ，3500W
Pneumatic device	Imported world famous brand AirTAC Original precision cylinder
Pressure system	Pressure system parallel bar structure eliminates the weight of the indenter, pressure minimum accuracy can up to 0.1 KG, pressure components are using SMC precision components.
Heating method	Pulse (rapid heating/cooling and auxiliary cooling)
Temperature Control System	Brand:Omron
	Adjustable temperature rise curve with high precision PID auto-tuning
	The peak temperature : within +/-1degrees Celsius
	Room temperature time to 180 degrees the response time within 2-3 seconds
Hot pressing head	Material: Titanium alloy
	Metal properties:SUS440C
	Origin: United States
	Plane precision (hot pressing surface) :0.001mm
	Plane thickness 0.5 (keep 3 times grinding)
Thermocouple Type	K type Original US OMEGA wire
Industrial control unit / program	Panasonic PLC FX－C14T
Industrial control unit / program	Panasonic Image Processing System
Touch unit	Display control Samkoon dual-core touch screen
Image unit	COF counterpoint: Down counterpoint
	(Optical Path: Lens> Quartz> ITO Electrode> COF)
	PCB alignment: with Front PCB Camera for PCB bonding
	Number of lens: 2
	Microscope: 200-300 continuous zoom
	COF Display: 19-inch HD
COF trimming unit	Origin: China
	Rail type: U-rail
	Accuracy:0.01
	Adjustable direction: X/Y/R
	R stroke: coarse adjustment 360 degrees, fine adjustment +/- 5 degrees
COF fixture	COF mechanical clamping type ,Z-direction tilt radius micrometer fine-tuning
Lens spinner unit	Control mode: X / Y / Z micrometer control
Lens spinner unit	Focus Adjustment: Manually adjust the focus
Silicone / Teflon	Manual switching position
LCD stage (platform)	Manual slide movement, self-contained vacuum adsorption device
Bonding head alignment	The cylinder can be set to stop in any position in the upper and lower directions
Control method	Touch screen + button operation
Parameter setting	Can store multiple sets of hot pressing parameters as needed
Rated voltage	AC 180-220V
Peak power	400-1100W (can support 68X1.2X10 wide bonding head)
Maximum power	1100W
Actual power	580W
Body size	*1800X1260x1550mm(LWH)*
Body size	*11608501450mm(LWH) Without Platform size*
Net weight of equipment	380KG
GLASS TABLE SIZE	*Glass size: 180080012MM*
Number of packages	2
Equipment packaging	Wooden boxes, non-logs
Equipment packaging	EXPORTED STANDARDS